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PACKAGE DIMENSIONS

SELECTION GUIDE

Notes:

θ1/2 is the angle from the optical centerline where the luminous intensity is half of the peak value.
Luminous intensity/luminous flux: +/-15%.
Luminous intensity value is traceable to CIE127-2007 standards.
APFA3010SEEZGQBDC 3.0 x 1.0 mm Right Angle SMD Chip LED Lamp

RECOMMENDED SOLDERING PATTERN (units: mm; tolerance: ± 0.1)

DESCRIPTIONS

Hyper Red source color devices are made with AlGaInP on GaAs substrate Light Emitting Diode.
Green source color devices are made with InGaN on Sapphire Light Emitting Diode.
Blue source color devices are made with InGaN Light Emitting Diode.
Electrostatic discharge and power surge could damage the LEDs.
Use a wrist band or anti-electrostatic glove when handling the LEDs.
All devices, equipment, and machinery must be electrically grounded.
FEATURES

3.0 x 1.5 x 1.0 mm right angle SMD LED, with a thickness of 1.0 mm.
Low power consumption.
Wide viewing angle.
Ideal for backlight and indicator applications.
Packaged in reels of 2000 pcs.
Moisture sensitivity level: Level 3.
Tinned pads for improved solderability.
RoHS compliant.
APPLICATIONS

Backlighting
Status indicators
Home and smart appliances
Wearable and portable devices
Healthcare applications
ATTENTION

Observe precautions for handling electrostatic discharge sensitive devices.

Part Number Emitting Color (Material) Lens Type Iv (mcd) @ 20mA [2] Viewing Angle [1] Min. Typ. 2θ1/2

APFA3010SEEZGQBDC
Hyper Red (AlGaInP) Water Clear 80 140 150°
Green (InGaN) 300 500
Blue (InGaN) 40 70
Notes:

All dimensions are in millimeters (inches).
Tolerance is ±0.2(0.008") unless otherwise noted.
The specifications, characteristics, and technical data are subject to change without prior notice.
The device has a single mounting surface and must be mounted according to the specifications.
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ABSOLUTE MAXIMUM RATINGS at TA=25°C

ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C

APFA3010SEEZGQBDC

Wavelength at Peak Emission (IF = 20mA, typ) λpeak: Hyper Red 630 nm, Green 515 nm, Blue 460 nm
Dominant Wavelength (IF = 20mA, typ) λdom: Hyper Red 621 nm, Green 525 nm, Blue 465 nm
Spectral Bandwidth at 50% Φ REL MAX (IF = 20mA, typ) Δλ: Hyper Red 20 nm, Green 35 nm, Blue 25 nm
Capacitance (typ) C: Hyper Red 25 pF, Green 45 pF, Blue 100 pF
Forward Voltage (IF = 20mA, typ, max) VF: Hyper Red 2.0 - 2.5 V, Green 3.3 - 4.1 V, Blue 3.3 - 4.0 V
Reverse Current (VR = 5V, max) IR: Hyper Red -, Green 10 µA, Blue 50 µA
Parameter Symbol Value Unit

Power Dissipation PD: Hyper Red 75 mW, Green 102.5 mW, Blue 120 mW
Reverse Voltage VR: 5 V
Junction Temperature T: 115 °C
Operating Temperature Top: -40 to +85 °C
Storage Temperature Tstg: -40 to +85 °C
DC Forward Current IF: Hyper Red 30 mA, Green 25 mA, Blue 30 mA
Peak Forward Current IFM: Hyper Red 195 mA, Green 150 mA, Blue 150 mA
Electrostatic Discharge Threshold (HBM): Hyper Red -, Green 3000 V, Blue 450 V
Thermal Resistance (Junction / Ambient) Rth JA: Hyper Red 405 °C/W, Green 650 °C/W, Blue 620 °C/W
Thermal Resistance (Junction / Solder point) Rth JS: Hyper Red 275 °C/W, Green 560 °C/W, Blue 535 °C/W
Notes:

The dominant wavelength (λd) is the setup value of the sorting machine. (Tolerance λd: ±1nm.)
Forward voltage: ±0.1V.
Wavelength value is traceable to CIE127-2007 standards.
Excess driving current or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.
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TECHNICAL DATA

Relative Intensity vs. Wavelength for Hyper Red, Green, and Blue LEDs at Ta = 25 °C.
Spatial Distribution of APFA3010SEEZGQBDC at various angles.
Forward Current vs. Forward Voltage and Luminous Intensity vs. Forward Current for each color.
Forward Current Derating Curve and Luminous Intensity vs. Ambient Temperature.
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TAPE SPECIFICATIONS (units: mm)

REEL DIMENSION (units: mm)

REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS

Notes:

Avoid causing stress to the LEDs while exposed to high temperature.
Maximum reflow soldering passes is 2 times.
Reflow soldering is recommended; other methods may damage the product.
PRECAUTIONARY NOTES

This document is for technical reference and reflects representative usage scenarios.
Part numbers, types, and specifications are subject to change without notice. Refer to the latest datasheet before production.
Operate products within the limits specified in the datasheet. Kingbright is not liable for issues arising from exceeding these limits.
This information applies to typical consumer electronics applications. For special reliability requirements or life-threatening liabilities, consult with Kingbright.
The document's contents may not be reproduced or re-transmitted without Kingbright's permission.
Refer to Kingbright application notes for all design applications.