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Home > Material Design Scheme

Overall Design Scheme for Materials

Seamless Compatibility

Seamless Compatibility

Our solution seamlessly integrates with your existing systems, enabling direct utilization from pin to pin.

One-click Optimization

Comprehensive Optimization

Simply send us the BOM (Bill of Materials), and we can comprehensively optimize all your materials, including delivery times, production status, supplementary options, samples, and more.

Cost Reduction

Reduced Material Costs

Experience significant cost reductions, with an average reduction of over 20%, saving your business valuable resources.

How does ECsimple achieve this?

1. Due to the strong technical specialization of electronic components, there is a widespread phenomenon of significant brand premium in this industry. For instance, the market price for ON Semiconductor's optocoupler product MOC3021, DIP6, is typically around 0.152 USD. Opting for LITE-ON (ON Semiconductor's contract manufacturer) optocoupler product MOC3021, DIP6, however, yields a market price of around 0.063 USD. This substitution approach ensures a high degree of consistency and quality with the original product while significantly reducing the cost of goods. ECsimple's decision is grounded in substantial professional knowledge and experience, rather than being arbitrary or unfounded.
2. The electronics components industry faces challenges due to the specialized nature of product technology and societal advancements. Many outdated solutions still utilize obsolete material models, leaving customers unaware that manufacturers have upgraded to newer materials or discontinued production of old ones. Consequently, customers often purchase outdated material models at excessively high prices. ECsimple, leveraging its expertise, can promptly discern outdated or discontinued materials and recommend cost-effective alternatives with more stable lead times to clients.
3. Due to the prolonged production cycles in the electronics components industry, certain goods often experience price spikes of up to tenfold due to factors such as spot demand, shortages, speculative trading, and limited applications. ECsimple is well aware of market speculation and can provide clients with better alternatives to outrageously priced products that significantly deviate from their intrinsic value. For instance, the LTV-817, DIP4, typically priced at 0.022 USD (as of 2022), may surge to 0.042 USD per unit due to speculation. In contrast, we can recommend the LTV-816, DIP4, which remains at a normal price of 0.026 USD since it avoids speculative trading. This price is considerably lower than 0.042 USD.

In summary, the "Overall Design Scheme for Materials" proposed by ECsimple can significantly reduce the client's goods costs by at least 20% or more. This scheme also mitigates the risks of costly supply chain disruptions or obsolescence due to lengthy delivery and allocation times, thereby reducing management expenses and component inventory. It enables clients to focus on their core manufacturing competencies. Additionally, we can identify cross-references with shapes suitable for functionality, thereby avoiding redesign efforts and providing multiple sourcing options. This proactive approach assists engineers in making design decisions.

“Overall Design Scheme for Materials” process


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