Our Efforts

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  External Visual Inspection

  Using a microscope, we primarily inspect the silk-screened area of the component for accuracy in typing, year, country of origin, and manufacturer logo positioning. We also check for signs of recoating, refinishing, or refurbishment, as well as any unidentified residues and pin realignment. Further confirmation of any coating on the chip surface is done through physical scraping or chemical wiping.
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  X-RAY

  X-ray testing, a non-destructive method, utilizes X-ray penetration to inspect the internal structure and lead imaging of ICs. It primarily involves X-ray irradiation imaging to examine hardware components inside the device. This includes checking the chip's pin framework, wafer size, wire bonding diagram, ESD voids, and damages.
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  Decapsulation

  Decapsulation testing primarily involves cutting and corroding the surface packaging of ICs using specialized equipment. This process is combined with metallographic microscopy to observe the presence of wafers inside the IC, ensuring their structure, size, lettering, and markings match the original sample. Additionally, it checks for any occurrences of EOS/ESD breakdown phenomena.
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  Soderability Test

  Solderability testing evaluates chip pin tin-plating ability through simulated solder consumption to meet standards. It assesses soldering performance of components, PCBs, solder, and flux, crucial for assembly quality and reliability. Scientific testing is vital to prevent defects and improve product quality, aiding engineers in achieving zero-defect soldering processes.
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  Electrical Test

  Electrical performance testing involves using testing equipment like semiconductor curve tracers to assess device pins and related data specified in the manufacturer's official specifications. Tests such as open and short circuit checks are conducted to inspect for chip damage.
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  SAT Test

  Scanning Acoustic Tomography (SAT), or ultrasonic testing, is a non-destructive method widely applied in material inspection (IQC), failure analysis (FA), quality control (QC), and research and development (R&D). It detects defects like delamination, cracks, and voids in electronic components, LEDs, and metal substrates by comparing ultrasonic scan images to determine defect characteristics.