© 2021 Kingbright. All Rights Reserved. Spec No: DSAP7044 / 1201009406 Rev No: V.3B Date: 01/04/2021

DESCRIPTIONS
An intelligent control LED light source integrating the control circuit and RGB chips in a 5050 package for complete pixel point control.
Utilizes unipolar NRZ communication mode for data protocol.
The integrated control chip simplifies circuitry, reduces size, and facilitates convenient installation.
Electrostatic discharge and power surges can damage LEDs; handle with wrist bands or anti-electrostatic gloves, and ensure all equipment is grounded.
FEATURES
Shared power source for the control circuit and the LED.
Intelligent protection against reverse connection.
Built-in electric reset and power lost reset circuit.
256-level grayscale adjustable circuit.
Built-in signal reshaping circuit.
Cascade port transmission signal by single line.
Moisture sensitivity level 3.
Halogen-free and RoHS compliant.
APPLICATIONS
Decorative and entertainment lighting.
Full color soft light strips.
Commercial and residential architectural lighting.
Signage applications.
ATTENTION
Observe precautions for handling electrostatic discharge sensitive devices.

PACKAGE DIMENSIONS
AAAF5050-MC-K12 5.0 x 5.0 mm Surface Mount LED Lamp

RECOMMENDED SOLDERING PATTERN (units: mm; tolerance: ± 0.1)

PIN CONFIGURATION
No. Symbol Function Description
1 VSS Ground
2 NC /
3 DI Control data signal input
4 VDD Power supply LED
5 VDD Power supply LED
6 DO Control data signal output

PIN FUNCTION
Confidential

© 2021 Kingbright. All Rights Reserved. Spec No: DSAP7044 / 1201009406 Rev No: V.3B Date: 01/04/2021

ELECTRICAL CHARACTERISTICS (TA=-20~+70°C, VDD=+4.5~+5.5V, VSS=0V)
Parameter Symbol Conditions Min. Typ. Max. Unit
Supply Voltage VDD - - 5 V
R / G / B Port Pressure VDS - - - 26 V
R / G / B Port Drive Current IOUT_R/G/B VDS_R/G/B - 12 mA

DYNAMIC CHARACTERISTICS at TA=25°C
Parameter Symbol Conditions Min. Typ. Max. Unit
Operation Frequency FDIN The Duty Ratio of 67%(Data 1) - 800 KHZ
Transmission Delay Time TPLH DIN → DOUT - 500 ns
TPHL - - 500 ns
IOUT Time TR - 70 ns
TF - 100 ns

DATA TRANSMISSION METHOD
Note: The data of D1 is sent by MCU, and D2,D3,D4 through pixel internal reshaping amplification to transmit.

TECHNICAL DATA TAPE SPECIFICATIONS (units: mm)
REEL DIMENSION (units: mm)

REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS

Notes: 1. Don't cause stress to the LEDs while exposed to high temperature. 2. The maximum number of reflow soldering passes is 2 times. 3. Reflow soldering is recommended; other methods may damage the product.

© 2021 Kingbright. All Rights Reserved. Spec No: DSAP7044 / 1201009406 Rev No: V.3B Date: 01/04/2021

PACKING & LABEL SPECIFICATIONS
AAAF5050-MC-K12

HANDLING PRECAUTIONS
Handle the component along the side surfaces using forceps or appropriate tools.
Avoid direct contact with the silicone lens surface to prevent internal circuitry damage.
Do not stack assembled PCBs with exposed LEDs to prevent lens scratching or circuitry damage.
Ensure the SMD pickup nozzle's inner diameter does not exceed the size of the LED and use a pliable material for the nozzle tip.
Accurately program component dimensions in the pick-and-place machine for precise handling.
Be cautious of corrosive substances like H2S that may corrode the silver plating of the leadframe due to silicone encapsulation's gas permeability.
PRECAUTIONARY NOTES
The information in this document is for technical reference and is subject to change without notice.
Refer to the latest datasheet for updated specifications before production usage.
Operate the product within the environmental and electrical limits specified in the datasheet.
For applications with special reliability requirements, consult with Kingbright for further assistance.
Do not reproduce or transmit this document without Kingbright's permission.
APPLICATION NOTES
For more information and application assistance, visit Kingbright Application Notes.