Chip Light Emitting Diode (LED) FC-3215SXK-630D08

Technical Data Sheet

This product is widely used as an electronic component for signal indication and illumination in various surface-mounted electronic devices, such as indicator lights for household appliances, mobile phone keypads, and dashboard indicators for vehicles.

Features:

Material: AlGaInP
Emitting Color: Red
Encapsulation: Epoxy Resin
Soldering Methods: Pb-Free Reflow Soldering
High Luminous Intensity, Low Power Dissipation, Good Reliability, and Long Lifespan
Complies with EU ROHS Directive
Note: Product specifications are subject to change without notice due to process improvements.

Outline Dimension and Polarity:

Polarity: Positive (+)
Recommended Soldering Pad Dimensions: Cuprum Area, Solder Resist: Tolerances unless mentioned are X.X±0.1, X.XX±0.05, Unit = mm
Electro-Optical Characteristics (At 25°C)

Absolute Maximum Ratings:

Forward Current (IF): 25 mA
Pulse Forward Current (IFP): 50 mA
Reverse Voltage (VR): 5 V
Operating Temperature (TOPR): -30 ~ +85 °C
Storage Temperature (Tstg): -40 ~ +100 °C
Power Dissipation (PD): 65 mW
Typical Values:

Reverse Current (IR at VR=5V): - 10 μA
View Angle (2θ1/2): 130°
Forward Voltage (VF at IF=20mA): 1.6 - 2.6 V
Peak Wavelength (λP): 640 nm
Dominant Wavelength (λd): 625 - 645 nm
Spectrum Radiation Bandwidth (Δλ): 15 nm
Luminous Intensity (IV): 65 - 150 mcd
Tolerances: Luminous Intensity ±15%, Forward Voltage ±0.1V, Hue (X,Y) ±0.01, Dominant Wavelength ±1nm.

All parameters are tested by the standard testing system of NationStar and are for reference only. In case of any discrepancy, please refer to the label on the actual product.

Typical Characteristics Curves

Forward Current Derating Curve
Luminous Intensity vs. Ambient Temperature
Volt-Ampere Characteristics
Relative Luminous Intensity vs. Forward Current
Relative Spectral Distribution
Luminous Intensity Distribution Characteristics

Reliability Test Items and Conditions

Test Items:

Thermal Shock
Temperature and Humidity Cycling
High-Temperature Storage
Low-Temperature Storage
Lifespan Test
Resistance to Soldering Heat
Test Conditions and Criteria:

Thermal Shock: -40°C to 100°C, 200 cycles
Temperature and Humidity Cycling: (-10 to 65)°C, (0 to 90)%RH, 10 cycles
High-Temperature Storage: 100°C for 1000 hours
Low-Temperature Storage: -40°C for 1000 hours
Lifespan Test: 25°C, 10 mA for 1000 hours
Resistance to Soldering Heat: 260°C for 10 seconds, 2 times
Criteria for Judging Damage:

Forward Voltage (VF at IF= IFT): Initial Data ±10%
Reverse Current (IR at VR= 5V): ≤10 μA
Luminous Intensity (IV at IF = IFT): Degradation ≤50%
Resistance to Soldering Heat: No dead light
Note: Tsol - Temperature of tin liquid; IFT - Typical current.

Packaging

Carrier Tape:

Dimensions in mm, tolerances unless mentioned is ±0.1 mm
Details of Carrier Tape: Top Cover Tape 200mm, Leader 100mm, 3000 Lamps Loaded, Trailer 100mm
Reel Dimension:

Label with Product Type, Quantity, Rank, Step Code, Lot Number, Wavelength Range, Luminous Intensity Range, Forward Voltage Range, and Testing Current
Moisture Proof and Anti-Electrostatic Foil Bag:

Sealed with Label, Moisture Absorbent Material
Cardboard Box:

Label with Company Name
Label Explanation:

TYPE: Product Model
QTY: Quantity
BIN: Rank
SC: Step Code
LOT: Lot Number
λd: Wavelength Range
IV: Luminous Intensity Range
VF: Forward Voltage Range
IF: Testing Current
QC PASS with QR Code