SPECIFICATION SHEET

Spec No: DSAM6352 / 1203013383

Rev No: V.5B

Date: 06/30/2018

Page: 1 of 4

APT2012ZGCK 2.0x1.25mm SMD Chip LED Lamp

Manufacturer: Kingbright

© 2018 Kingbright. All Rights Reserved.

PRODUCT DESCRIPTION
The APT2012ZGCK is a Green LED lamp utilizing InGaN on Sapphire Light Emitting Diode technology. It is sensitive to electrostatic discharge and power surges, necessitating the use of anti-static measures during handling.

FEATURES
Compact 2.0 mm x 1.25 mm SMD LED with 0.75 mm thickness
Low power consumption for energy efficiency
Wide viewing angle for enhanced visibility
Ideal for backlight and indicator applications
Packaged in reels of 2000 pcs for convenience
Moisture sensitivity level 3 for reliable handling
RoHS compliant for environmental sustainability
APPLICATIONS
Backlighting for various displays and screens
Status indicators in electronic devices
Illumination in home and smart appliances
Visibility enhancement in wearable and portable devices
Indicator lights in healthcare applications
ATTENTION
Handle with care to avoid damage from electrostatic discharge
Use wrist bands or anti-electrostatic gloves when handling
Ensure all equipment is electrically grounded
PACKAGE DIMENSIONS
Refer to Selection Guide for detailed dimensions and tolerances.

SELECTION GUIDE
θ1/2: Angle from the optical centerline where luminous intensity is half of the peak value
Luminous Intensity/Flux: Tolerance of +/-15%
ELECTRICAL / OPTICAL CHARACTERISTICS
Test Conditions: TA=25°C

Parameter Symbol Green Unit Typ. Max.
Wavelength at Peak Emission λpeak 515 nm nm
Dominant Wavelength λdom 525 nm nm
Spectral Bandwidth at 50% Δλ 35 nm nm
Capacitance C 45 pF pF
Forward Voltage VF 3.3 - 4.1 V V
ABSOLUTE MAXIMUM RATINGS
Power Dissipation: 102.5 mW
Reverse Voltage: 5 V
Junction Temperature: 115 °C
Operating Temperature: -40 to +85 °C
Storage Temperature: -40 to +85 °C
DC Forward Current: 25 mA
Peak Forward Current: 150 mA
Electrostatic Discharge Threshold: 450 V
TECHNICAL DATA
Includes graphs and charts for Relative Intensity vs. Wavelength, Spatial Distribution, Forward Current vs. Forward Voltage, Luminous Intensity vs. Forward Current, and Luminous Intensity vs. Ambient Temperature.

REFLOW SOLDERING PROFILE
Recommended for Lead-Free SMD Process, with precautions and spatial distribution.

PACKING & LABEL SPECIFICATIONS
Refer to the last page for detailed packing and label specifications.

PRECAUTIONARY NOTES
The information provided is for technical reference and may change without notice.
Refer to the latest datasheet for the most up-to-date specifications.
Operate within the environmental and electrical limits specified.
For applications with special reliability requirements, consult with Kingbright.
Do not reproduce or transmit information without permission.