pec No: DSAH3716 / 1202001192 Rev No: V.8B Date: 11/06/2021 Page 1 / 4

© 2021 Kingbright. All Rights Reserved.

DESCRIPTIONS

The Green source color devices are made with InGaN on Sapphire Light Emitting Diode.
Electrostatic discharge and power surge could damage the LEDs.
It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs.
All devices, equipment, and machinery must be electrically grounded.
FEATURES

Subminiature package.
Gull wing lead.
Long life - solid state reliability.
Low package profile.
Moisture sensitivity level: 3.
Package: 1000 pcs / reel.
Halogen-free.
RoHS compliant.
APPLICATIONS

Backlight.
Status indicator.
Home and smart appliances.
Wearable and portable devices.
Healthcare applications.
ATTENTION
Observe precautions for handling electrostatic discharge sensitive devices.

PACKAGE DIMENSIONS

All dimensions are in millimeters (inches).
Tolerance is ±0.25(0.01") unless otherwise noted.
Lead spacing is measured where the leads emerge from the package.
The specifications, characteristics, and technical data described in the datasheet are subject to change without prior notice.
The device has a single mounting surface. The device must be mounted according to the specifications.
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ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C

ABSOLUTE MAXIMUM RATINGS at TA=25°C

Parameter Symbol Emitting Color Value Unit Typ. Max.
Wavelength at Peak Emission λpeak Green 515 nm -
Dominant Wavelength λdom Green 525 nm -
Spectral Bandwidth at 50% ∆λ Green 30 nm -
Capacitance C Green 45 pF -
Forward Voltage VF Green 3.3 V 4.1
Reverse Current IR Green - 50 µA
THERMAL AND ELECTRICAL CHARACTERISTICS

Parameter Symbol Value Unit Conditions
Power Dissipation PD 102.5 mW -
Reverse Voltage VR 5 V -
Junction Temperature T 115 °C -
Operating Temperature Top -40 to +85 °C -
Storage Temperature Tstg -40 to +85 °C -
DC Forward Current IF 25 mA -
Peak Forward Current IFM 150 mA -
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TECHNICAL DATA

Forward Current vs. Forward Voltage
Luminous Intensity vs. Forward Current
Forward Current Derating Curve
Luminous Intensity vs. Ambient Temperature
REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS

Reflow soldering is recommended. Other soldering methods are not recommended as they might cause damage to the product.
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PACKING & LABEL SPECIFICATIONS

PRECAUTIONARY NOTES

The information included in this document reflects representative usage scenarios and is intended for technical reference only.
The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice.
When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet.
The information in this document applies to typical usage in consumer electronics applications.
The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.